Semiconductor devices and semiconductor packages

ABSTRACT

A semiconductor device includes a semiconductor element, a trace disposed adjacent to a surface of the semiconductor element, a bonding pad disposed adjacent to the surface of the semiconductor element and connected to the trace, and a pillar disposed on the bonding pad. The pillar includes a first end wall, a second end wall opposite the first end wall, a first side wall, and a second side wall opposite the first side wall. The first side wall and the second side wall connect the first end wall to the second end wall. One or both of the first side wall and the second side wall incline inwardly from the first end wall to the second end wall. The pillar is disposed on the bonding pad such that the first end wall is closer to the trace than is the second end wall.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.15/076,831, filed on Mar. 22, 2016, the contents of which areincorporated herein by reference in their entireties.

BACKGROUND 1. Technical Field

The present disclosure relates to a semiconductor device and asemiconductor package, and, more particularly, to a semiconductor deviceincluding one or more pillar structures and a semiconductor packageincluding the same.

2. Description of the Related Art

In a semiconductor flip-chip bonding process, an upper chip is placed ona lower chip (or a substrate). The upper chip may be electricallyconnected to the lower chip (or substrate) through metal pillarsdisposed on the upper chip, and through lower bonding pads disposed onthe lower chip. Solder may be used to physically connect the metalpillars and the lower ponding pads.

As a semiconductor device and the metal pillars thereof continue toscale down in size, a current density in the metal pillars increases.The increase in current density results in a current crowding region,which generally occurs in a top region of the metal pillar. The currentcrowding region results in joule heating that can cause damage to themetal pillar. Therefore, it would be desirable to provide asemiconductor device including a pillar structure and a semiconductorpackage including the same, to reduce a current crowding region or toreduce joule heating.

SUMMARY

In an aspect, a semiconductor device includes a semiconductor element, atrace disposed adjacent to a surface of the semiconductor element, abonding pad disposed adjacent to the surface of the semiconductorelement and connected to the trace, and a pillar disposed on the bondingpad. The pillar includes a first end wall, a second end wall oppositethe first end wall, a first side wall, and a second side wall oppositethe first side wall. The first side wall and the second side wallconnect the first end wall to the second end wall. One or both of thefirst side wall and the second side wall incline inwardly from the firstend wall to the second end wall. The pillar is disposed on the bondingpad such that the first end wall is closer to the trace than is thesecond end wall.

In an aspect, a semiconductor device includes a semiconductor element, atrace disposed adjacent to a surface of the semiconductor element, abonding pad connected to the trace, and a pillar disposed on the bondingpad. The pillar includes a first end adjacent to the trace and a secondend away from the trace, and the first end is wider than the second end.

In an aspect, a semiconductor package includes a first semiconductorelement and a second semiconductor element. The first semiconductorelement includes a first trace, a first bonding pad connected to thefirst trace, and a pillar disposed on the first bonding pad. The pillarincludes a first end wall adjacent to the first trace, a second end wallopposite the first end wall and remote from the first trace, a firstside wall, and a second side wall opposite the first side wall. Thefirst side wall and the second side wall connect the first end wall tothe second end wall. One or both of the first side wall and the secondside wall incline inwardly from the first end wall to the second endwall. The second semiconductor element includes a second trace and asecond bonding pad connected to the second trace. The pillar is bondedto the second bonding pad.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A illustrates a cross-sectional view of a semiconductor deviceaccording to an embodiment of the present disclosure.

FIG. 1B illustrates a perspective view of a pillar structure of thesemiconductor device illustrated in FIG. 1A according to an embodimentof the present disclosure.

FIG. 2 illustrates a perspective view of the semiconductor deviceillustrated in FIG. 1A according to an embodiment of the presentdisclosure.

FIG. 3 illustrates a perspective view of a semiconductor packageaccording to an embodiment of the present disclosure.

FIG. 4 illustrates a bottom view of the semiconductor device illustratedin FIG. 1A according to an embodiment of the present disclosure.

FIG. 5 illustrates a bottom view of a semiconductor device according toan embodiment of the present disclosure.

FIG. 6 illustrates a cross-sectional view of a pillar according to anembodiment of the present disclosure.

FIG. 7 illustrates a cross-sectional view of a pillar according to anembodiment of the present disclosure.

FIG. 8 illustrates a cross-sectional view of a pillar according to anembodiment of the present disclosure.

FIG. 9 illustrates a cross-sectional view of a pillar according to anembodiment of the present disclosure.

FIG. 10 illustrates a cross-sectional view of a pillar according to anembodiment of the present disclosure.

FIG. 11 illustrates a top view of a bonding pad and a portion of a traceaccording to an embodiment of the present disclosure.

FIG. 12 illustrates a cross-sectional view of a semiconductor deviceaccording to an embodiment of the present disclosure.

FIG. 13 illustrates a cross-sectional view of a semiconductor packageaccording to an embodiment of the present disclosure.

FIG. 14A, FIG. 14B, FIG. 14C, FIG. 14D, FIG. 14E, FIG. 14F and FIG. 14Gillustrate a manufacturing method in accordance with an embodiment ofthe present disclosure.

FIG. 15A, FIG. 15B, FIG. 15C, FIG. 15D, FIG. 15E, FIG. 15F, FIG. 15G,and FIG. 15H illustrate a manufacturing method in accordance with anembodiment of the present disclosure.

DETAILED DESCRIPTION

Spatial descriptions, such as “above,” “below,” “up,” “left,” “right,”“down,” “top,” “bottom,” “vertical,” “horizontal,” “side,” “higher,”“lower,” “upper,” “over,” “under,” and so forth, are indicated withrespect to the orientation shown in the figures unless otherwisespecified. It should be understood that the spatial descriptions usedherein are for purposes of illustration only, and that practicalimplementations of the structures described herein can be spatiallyarranged in any orientation or manner, provided that the merits ofembodiments of this disclosure are not deviated by such arrangement.

In a semiconductor flip-chip bonding process, an upper chip is placed ona lower chip (or a substrate). The upper chip may be electricallyconnected to the lower chip (or to a substrate) through metal pillarsdisposed on the upper chip and through lower bonding pads disposed onthe lower chip. Solder is disposed to connect the metal pillars and thelower bonding pads. A reflow process melts the solder so that the metalpillars can bond with the bonding pads, to form a flip-chip bondingstructure. However, such bonding structures can be fragile, as currentcrowding is often generated at a corner portion of a metal pillar thatis vertically connected to a bonding pad (or a trace). The currentcrowding may generate joule heating and thus accumulate heat, which mayin turn break the metal pillar or a solder connection, and may furtheraffect the electrical connection. A result may be low reliability.

The semiconductor device of the present disclosure provides for animproved bonding structure with reduced current crowding or reducedaccumulation of joule heating, particularly at the corner portion of themetal pillar connecting to a bonding pad (or a trace).

FIG. 1A illustrates a cross-sectional view of a semiconductor device 100according to an embodiment of the present disclosure. The semiconductordevice 100 of FIG. 1A includes a semiconductor element 102, multiplepillar structures including a pillar structure 104, and a firstinsulation layer 108.

The semiconductor element 102 may be a chip, a package, or aninterposer. The semiconductor element 102 has a first surface 102 a andone or more bonding pads 106. The bonding pad 106 is disposed adjacentto the first surface 102 a of the semiconductor element 102. The bondingpad 106 may be, for example, a contact pad of a trace. In the embodimentof FIG. 1A, the first surface 102 a is an active surface, the bondingpad 106 is a contact pad, and the bonding pad 106 is disposed directlyon the first surface 102 a of the semiconductor element 102. The bondingpad 106 may include, for example, one of, or a combination of, copper,gold, indium, tin, silver, palladium, osmium, iridium, ruthenium,titanium, magnesium, aluminum, cobalt, nickel, or zinc, or other metalsor metal alloys.

The first insulation layer 108 is disposed adjacent to the first surface102 a of the semiconductor element 102. In the embodiment of FIG. 1A,the first insulation layer 108 is disposed directly on the first surface102 a of the semiconductor element 102 to cover a portion of the bondingpad 106 and the first surface 102 a of the semiconductor element 102.The first insulation layer 108 defines one or more openings 1081. Eachopening 1081 corresponds to a respective bonding pad 106 and exposes atleast a portion of the bonding pad 106. The first insulation layer 108may be a passivation layer (the material of which may be silicon oxideor silicon nitride, or another insulation material).

The pillar structure 104 is a conductive column structure. The pillarstructure 104 illustrated in FIG. 1A is disposed on the exposed portionof the illustrated bonding pad 106 and on the first insulation layer108. As seen in FIG. 1A, the pillar structure 104 includes an under bumpmetallization (UBM) layer 1041, a pillar 1043, a barrier layer 1045, anda solder layer 1047. In some embodiments, one or both of the barrierlayer 1045 and the solder layer 1047 are omitted from the pillarstructure 104.

FIG. 1B illustrates a perspective view of the pillar structure 104 ofFIG. 1A. FIG. 1B shows an outer boundary of the pillar structure 104,illustrating that outer boundaries of the included UBM layer 1041,pillar 1043, barrier layer 1045, and solder layer 1047 before solderreflow are the same (e.g., within manufacturing tolerances).

The pillar 1043 has a first end wall 1043 a, a second end wall 1043 bopposite the first end wall 1043 a, a first side wall 1043 c, and asecond side wall 1043 d opposite the first side wall 1043 c. The firstside wall 1043 c and the second side wall 1043 d connect the first endwall 1043 a to the second end wall 1043 b. One or both of the first sidewall 1043 c and the second side wall 1043 d incline inwardly, or taper,from the first end wall 1043 a to the second end wall 1043 b, such thatthe first side wall 1043 c and the second side wall 1043 d are notparallel. Accordingly, the pillar 1043 will be wider towards, oradjacent, the first end wall 1043 a than it is towards, or adjacent, thesecond end wall 1043 b.

FIG. 2 illustrates a perspective view of the pillar structure 104 ofFIG. 1A in relation to the bonding pad 106. As illustrated, the bondingpad 106 is a contact pad of a trace 107. In an embodiment, the pillarstructure 104 may be vertically connected to the trace 107 by disposingthe pillar structure 104 on the bonding pad 106. In the embodimentillustrated in FIG. 2, the wider portion of the pillar structure 104(e.g., at the first end wall 1043 a of the pillar 1043) is positionedtowards the trace 107, so that current flowing in the trace 107 may flowthrough the wider portion of the pillar structure 104, and currentcrowding may be reduced at the portion of the pillar structure 104connecting to the bonding pad 106. Therefore, the accumulation of jouleheating and breakage of the pillar structure 104 or a solder connectioncan be reduced or eliminated, and the electrical connection maycorrespondingly be improved.

FIG. 3 illustrates a perspective view of an embodiment of asemiconductor package 300 including the semiconductor device 100 of FIG.1A. The semiconductor package 300 of FIG. 3 includes the semiconductordevice 100 of FIG. 1A and a second semiconductor element 302. Somefeatures of the semiconductor device 100 are omitted from theillustration in FIG. 3 to highlight certain concepts of thesemiconductor package 300. The second semiconductor element 302 may be achip, a substrate, a package, or an interposer.

The second semiconductor element 302 includes one or more second bondingpads 306. The semiconductor device 100 may be electrically connected tothe second semiconductor element 302 through the pillar structure 104disposed on the semiconductor device 100 and through the second bondingpad 306 disposed on the second semiconductor element 302. The secondbonding pad 306 connects to a trace 307 disposed adjacent to a surfaceof the second semiconductor element 302. The second bonding pad 306 mayinclude, for example, one of, or a combination of, copper, gold, indium,tin, silver, palladium, osmium, iridium, ruthenium, titanium, magnesium,aluminum, cobalt, nickel, or zinc, or other metals or metal alloys.

The second bonding pad 306 includes a first end wall 306 a, a second endwall 306 b opposite the first end wall 306 a, a first side wall 306 c,and a second side wall 306 d opposite the first side wall 306 c. Thefirst side wall 306 c and the second side wall 306 d connect the firstend wall 306 a to the second end wall 306 b. One or both of the firstside wall 306 c and the second side wall 306 d incline inwardly, ortaper, from the first end wall 306 a to the second end wall 306 b, suchthat the first side wall 306 c and the second side wall 306 d are notparallel. Accordingly, the second bonding pad 306 will be wider towards,or adjacent, the first end wall 306 a than it is towards, or adjacent,the second end wall 306 b.

In the embodiment illustrated in FIG. 3, the wider portion of the secondbonding pad 306 (e.g., at the first end wall 306 a) is positionedtowards the trace 307, so that current flowing in the trace 307 may flowthrough the wider portion of the second bonding pad 306, and currentcrowding may be reduced at the portion of the second bonding pad 306connecting to the trace 307. Therefore, the accumulation of jouleheating and breakage of the second bonding pad 306 or a solderconnection can be reduced or eliminated, and the electrical connectionmay correspondingly be improved.

A cross-sectional shape and area of the second bonding pad 306 of FIG. 3may be similar to a cross-sectional shape and area of the pillar 1043 orthe pillar structure 104 of FIG. 1B, but is not necessarily so. In someembodiments, the cross-sectional shape and area of the second bondingpad 306 is different than the cross-sectional shape and area of thepillar 1043 or the pillar structure 104.

FIG. 4 illustrates a bottom view of an embodiment of the semiconductordevice 100 of FIG. 1A, with the pillar structure 104 (including thepillar 1043) positioned on the bonding pad 106. The first end wall 1043a of the pillar 1043 is a convex wall including a first radius R₁ ofcurvature, and the second end wall 1043 b of the pillar 1043 is a convexwall including a second radius R₂ of curvature. In this embodiment, thefirst radius R₁ of curvature is greater than the second radius R₂ ofcurvature.

In some embodiments, each of the first radius R₁ of curvature and thesecond radius R₂ of curvature describe a radius of a circle, such that ashape of the first end wall 1043 a represents an arc of a first circleand the shape of the second end wall 1043 b represents an arc of asecond circle, and a relationship between R₁ and R₂ is defined by thefollowing equation:θ₁=sin⁻¹((R ₁-R ₂)/D)where D represents a distance between an origin of the circle of radiusR₁ and an origin of the circle of radius R₂. In some embodiments, theangle θ₁ can be from 0° to about 45°, from 0° to about 40°, from 0° toabout 35°, from 0° to about 30°, from 0° to about 25°, from 0° to about20°, from 0° to about 15°, from 0° to about 10°, or from 0° to about 5°.In some embodiments, a ratio of R₁ to R₂ is greater than 1:1. In someembodiments, a ratio of R₁ to R₂ is from about 1.1:1 to about 2.5:1,from about 1.2:1 to about 2.4:1, from about 1.3:1 to about 2.3:1, fromabout 1.4:1 to about 2.2:1, or from about 1.5:1 to about 2.1:1. In someembodiments, a ratio of R₁ to R₂ is about 1.1:1, about 1.2:1, about1.3:1, about 1.4:1, about 1.5:1, about 1.6:1, about 1.7:1, about 1.8:1,about 1.9:1, about 2:1, about 2.1:1, about 2.2:1, about 2.3:1, about2.4:1, or about 2.5:1.

For an embodiment of the semiconductor device 100 similar to thatillustrated in FIG. 4, effects of varying the ratio of R₁ to R₂ on acurrent density of a pillar is as shown in Table 1. The “current densityratio” in the right column of Table 1 refers to a comparison of a pillarhaving the R₁:R₂ ratio given in the left column of Table 1 to a pillarhaving an R₁:R₂ ratio of 1:1 (a pillar with an oval or circular shape).Accordingly, for a pillar with an R₁:R₂ ratio of 1:1 as shown in theleft column for the first entry of the table, the current density ratiois 1.

TABLE 1 R₁:R₂ ratio Current density ratio  1:1 1 1.2:1 0.87 1.5:1 0.85 2:1 0.47

The current density results shown in Table 1 were obtained by computersimulation of a model of a pillar (e.g., pillar 1043), where the currentdensity was represented by vectors, and the model of the pillar wastested by applying a (simulated) voltage to one end of the pillar andforcing the voltage at the other end of the pillar to be zero(grounded). In this manner, a current density distribution in the pillarwas obtained for different R₁:R₂ ratios. From the distribution it can beidentified where the current density is greatest.

Simulation of a traditional pillar (circular or oval) indicated that thecorners connecting the trace to the pillars tend to have the greatestcurrent density, as shown in Table 1 for a pillar having a ratio R₁:R₂of 1:1 (a pillar in a circular or oval shape).

From Table 1 it can be seen that the current density ratio decreases asthe ratio of R₁ to R₂ increases. That is, by designing the pillar (e.g.,1043) to have a wider end (e.g., at the first end wall 1043 a) towardthe trace 107, current crowding generated in the pillar can be reduced.It can further be seen from Table 1 that a reduction of approximately53% in current density ratio may be achieved using a ratio of R₁ to R₂of about 2:1 as compared to a ratio of R₁ to R₂ of 1:1.

Similarly, referring back to FIG. 3, current crowding in the secondbonding pad 306 can be reduced by increasing a width of the secondbonding pad 306 towards the first end wall 306 a relative to a width ofthe second bonding pad 306 towards the second end wall 306 b, andpositioning the wider portion of the second bonding pad 306 towards thetrace 307.

FIG. 5 illustrates a bottom view of an embodiment of a semiconductordevice 500 in which a pillar structure including a pillar 5043 ispositioned over a bonding pad 106. The semiconductor device 500 issimilar to that illustrated in FIG. 4, with a difference being that thepillar 5043 in FIG. 5 is rotated in a horizontal direction with respectto the bonding pad 106 or the trace 107 as compared to the pillar 1043in FIG. 4. Referring to FIG. 4, a dot-dash line shows a center line ofthe pillar 1043, which is also a center line of the bonding pad 106 anda center line of the trace 107. Comparing to FIG. 5, a first dot-dashline shows a center line of the pillar 5043 and a second dot-dash lineshows the center line of the bonding pad 106 and the trace 107, and anangle θ₂ is formed between the two center lines. In some embodiments,the angle θ₂ can be from 0° to about 45°, from 0° to about 40°, from 0°to about 35°, from 0° to about 30°, from 0° to about 25°, from 0° toabout 20°, from 0° to about 15°, from 0° to about 10°, or from 0° toabout 5°. In some embodiments, the angle θ₂ can be greater than 0° andwithin the previously stated ranges. As can be seen in FIG. 5, eventhough the pillar 5043 is rotated by the angle θ₂, a portion of thepillar 5043 facing the trace 107 is wider than the narrowest portion ofthe pillar 5043, and current crowding is reduced (e.g., as compared to apillar of consistent width along its length).

Similarly, referring back to FIG. 3, the second bonding pad 306 may berotated with respect to a central line of the trace 307, and a reductionof current crowding may still be achieved. In some embodiments, an angleof rotation of the second bonding pad 306 with respect to the centralline of the trace 307 is equal to or less than about 45°, such as from0° to about 45°, from 0° to about 40°, from 0° to about 35°, from 0° toabout 30°, from 0° to about 25°, from 0° to about 20°, from 0° to about15°, from 0° to about 10°, or from 0° to about 5°. In some embodiments,the angle of rotation can be greater than 0° and within the previouslystated ranges.

Still referring back to FIG. 3, and considering the discussion aboverelated to rotation of the pillar 5043 and rotation of the secondbonding pad 306, it should be understood that one or both of the pillar1043 and the second bonding pad 306 of FIG. 3 may be rotated withrespect to the traces 107, 307, respectively. Further, an angle ofrotation of the pillar 1043 with respect to the bonding pad 107 may besimilar to, or may be different from, the angle of rotation of thesecond bonding pad 306 with respect to the trace 307. Additionally, thetraces 107, 307 may extend in different directions with respect to eachother from the pillar structure 104 and the bonding pad 306 (e.g.,approximately 180° different in FIG. 3). Therefore, a displacement anglemay occur between a center line of the pillar 1043 and a center line ofthe second bonding pad 306 (e.g., approximately 180° in FIG. 3).

The pillar structure 104 of FIG. 1A can have a cross-sectional shapedifferent from the cross-sectional shape illustrated in bottom view inFIG. 4. Some examples are provided in FIGS. 6-10, illustratingcross-sections along a line AA′ in FIG. 1A.

FIG. 6 illustrates a cross-sectional view of a pillar structure 604 inaccordance with an embodiment of the present disclosure. An outerboundary of the pillar structure 604 is similar to the outer boundaryillustrated in the embodiment of FIG. 4, with a difference being thatboth the first side wall 1043 c and the second side wall 1043 d areconcave. In other embodiments, one of the first side wall 1043 c and thesecond side wall 1043 d is concave and the other is not.

FIG. 7 illustrates a cross-sectional view of a pillar structure 704 inaccordance with an embodiment of the present disclosure. An outerboundary of the pillar structure 704 is similar to the outer boundaryillustrated in the embodiment of FIG. 4, with a difference being thatboth the first side wall 1043 c and the second side wall 1043 d areconvex. In other embodiments, one of the first side wall 1043 c and thesecond side wall 1043 d is convex and the other is not.

FIG. 8 illustrates a cross-sectional view of a pillar structure 804 inaccordance with an embodiment of the present disclosure. An outerboundary of the pillar structure 804 is similar to the outer boundaryillustrated in the embodiment of FIG. 4, with a difference being thatthe first side wall 1043 c and the second side wall 1043 d are curved ina same direction.

FIG. 9 illustrates a cross-sectional view of a pillar structure 904 inaccordance with an embodiment of the present disclosure. An outerboundary of the pillar structure 904 is similar to the outer boundaryillustrated in the embodiment of FIG. 4, with a difference being thatthe first end wall 1043 a and the second end wall 1043 b aresubstantially flat (e.g., not rounded).

FIG. 10 illustrates a cross-sectional view of a pillar structure 1004 inaccordance with an embodiment of the present disclosure. An outerboundary of the pillar structure 1004 is similar to the outer boundaryillustrated in the embodiment of FIG. 4, with a difference being thatthe first end wall 1043 a, the second end wall 1043 b, the first sidewall 1043 c, and the second side wall 1043 d are each concave.

FIG. 11 illustrates a top view of a bonding pad 1106 of the trace 107 inaccordance with an embodiment of the present disclosure. An outerboundary of the bonding pad 1106 is similar to an outer boundary of thebonding pad 106 illustrated and described with respect to the embodimentof FIG. 4, with a difference being that the bonding pad 1106 is narrowedand has a spade-like shape, to reduce a space occupied by the bondingpad 1106 and to reduce material costs.

It should be noted that the technical features disclosed above can becombined together without departing from the merits of the presentdisclosure.

FIG. 12 illustrates a cross-sectional view of a semiconductor device1200 according to an embodiment of the present disclosure. Thesemiconductor device 1200 of FIG. 12 is similar to the semiconductordevice 100 of FIG. 1A, with a difference being that a second insulationlayer 109 is disposed adjacent to the first surface 102 a of thesemiconductor element 102. The second insulation layer 109 covers thefirst insulation layer 108 and a portion of the bonding pad 106. Thesecond insulation layer 109 defines one or more first openings 1091.Each first opening 1091 corresponds to a respective bonding pad 106 andexposes at least a portion of the bonding pad 106. The second insulationlayer 109 may be an organic insulating layer, the material of which is,for example, a polyimide (PI) or other polymer.

FIG. 13 illustrates a cross-sectional view of a semiconductor package1300 according to an embodiment of the present disclosure. Thesemiconductor package 1300 of FIG. 13 is similar to that illustrated anddescribed with reference to the embodiment of FIG. 3, with a differencebeing that the pillar structure 104 further includes an extended portion1049 along a portion of a corner of the pillar structure 104 facing thetrace 107, to reduce current crowding and improve current flow at thecorner of the pillar 1043. In some embodiments, the second bonding pad306 may also include an extended portion 3061 along a portion of acorner of the second bonding pad 306 facing the trace 307, to reducecurrent crowding and improve current flow at the corner of the secondbonding pad 306.

FIGS. 14A-14G illustrate a manufacturing method in accordance with anembodiment of the present disclosure.

Referring to FIG. 14A, a semiconductor element 102 is provided. Thesemiconductor element 102 includes a first surface 102 a and one or morebonding pads 106. The bonding pad 106 is formed on an active surface ofthe semiconductor element 102. A first insulation layer 108 is formed tocover a portion of the bonding pad 106 and the first surface 102 a ofthe semiconductor element 102. The first insulation layer 108 definesone or more openings 1081. A portion of the bonding pad 106 is exposedby the first insulation layer 108.

Referring to FIG. 14B, a metal layer 1041 a is formed on the firstinsulation layer 108 and the exposed portion of the bonding pad 106. Themetal layer 1041 a may be formed, for example, by a sputteringtechnique. The metal layer 1041 a may include, but is not limited to,copper, titanium, tungsten, an alloy thereof, or another suitable metalor alloy.

Referring to FIG. 14C, a patterned mask 1401 is formed on the metallayer 1041 a to expose a portion of the metal layer 1041 a. The exposedportion of the metal layer 1041 a may have an outer boundary similar tothat of the pillar structure 104 as illustrated and described withreference to the embodiments of FIG. 4 or FIGS. 6-10. The patterned mask1401 may be formed, for example, by a photolithography technique.

Referring to FIG. 14D, a metal pillar 1043 is formed on the exposedportion of the metal layer 1041 a, and a barrier layer 1045 is formed onthe metal pillar 1043. The metal pillar 1043 and the barrier layer 1045may be formed, for example, by a plating technique. The metal pillar1043 may include, but is not limited to, copper or another suitablemetal or an alloy thereof. The barrier layer 1045 may include, but isnot limited to, nickel, copper, an alloy thereof, or another suitablemetal or alloy.

Referring to FIG. 14E, a solder layer 1047 a is formed on the barrierlayer 1045. The solder layer 1047 a may be formed, for example, usingphotolithography and etching techniques.

Referring to FIG. 14F, the patterned mask 1401 is removed.

Referring to FIG. 14G, a portion of the metal layer 1041 a not coveredby the metal pillar 1043 is removed to form a UBM layer 1041. Theportion of the metal layer 1041 a may be removed, for example, by anetching technique. Then, the solder layer 1047 a is reflowed to form asemiconductor device 100 as illustrated in FIG. 1A.

FIGS. 15A-15H illustrate a manufacturing method in accordance with anembodiment of the present disclosure.

Referring to FIG. 15A, a semiconductor element 102 is provided. Thesemiconductor element 102 includes a first surface 102 a and one or morebonding pads 106. The bonding pad 106 is formed on an active surface ofthe semiconductor element 102. A first insulation layer 108 is formed tocover to cover a portion of the bonding pad 106 and the first surface102 a of the semiconductor element 102. The first insulation layer 108defines one or more openings 1081. A portion of the bonding pad 106 isexposed by the first insulation layer 108.

Referring to FIG. 15B, a second insulation layer 109 is disposed on thefirst insulation layer 108 and the bonding pad 106. The secondinsulation layer 109 defines one or more openings 1091. A portion of thebonding pad 106 is exposed by the second insulation layer 109. Thesecond insulation layer 109 may include, but is not limited to, apolyimide or other suitable material that may provide stress absorptionduring assembly operation.

Referring to FIG. 15C, a metal layer 1041 a is formed on the secondinsulation layer 109 and the exposed portion of the bonding pad 106. Themetal layer 1041 a may be formed, for example, by a sputteringtechnique. The metal layer 1041 a may include, but is not limited to,copper, titanium, an alloy thereof, or another suitable metal or alloy.

Referring to FIG. 15D, a patterned mask 1401 is formed on the metallayer 1041 a to expose a portion of the metal layer 1041 a. The exposedportion of the metal layer 1041 a may have an outer boundary similar tothat of the pillar structure 104 as illustrated and described withreference to the embodiments of FIG. 4 or FIGS. 6-10. The patterned mask1401 may be formed, for example, by a photolithography technique.

Referring to FIG. 15E, a metal pillar 1043 is formed on the exposedportion of the metal layer 1041 a, and a barrier layer 1045 is formed onthe metal pillar 1043. The metal pillar 1043 and the barrier layer 1045may be formed, for example, by a plating technique. The metal pillar1043 may include, but is not limited to, copper or another suitablemetal, or an alloy thereof. The barrier layer 1045 may include, but isnot limited to, nickel, an alloy thereof, or another suitable metal oralloy.

Referring to FIG. 15F, a solder layer 1047 a is formed on the barrierlayer 1045. The solder layer 1047 a may be formed, for example, usingphotolithography and etching techniques.

Referring to FIG. 15G, the patterned mask 1401 is removed.

Referring to FIG. 15H, a portion of the metal layer 1041 a not coveredby the metal pillar 1043 is removed to form a UBM layer 1041. Theportion of the metal layer 1041 a may be removed, for example, by anetching technique. Then, the solder layer 1047 a is reflowed to form asemiconductor device 1200 as illustrated in FIG. 12.

As used herein and not otherwise defined, the terms “substantially,”“substantial,” “approximately” and “about” are used to describe andaccount for small variations. When used in conjunction with an event orcircumstance, the terms can encompass instances in which the event orcircumstance occurs precisely as well as instances in which the event orcircumstance occurs to a close approximation. For example, when used inconjunction with a numerical value, the terms can encompass a range ofvariation of less than or equal to ±10% of that numerical value, such asless than or equal to ±5%, less than or equal to ±4%, less than or equalto ±3%, less than or equal to ±2%, less than or equal to ±1%, less thanor equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to±0.05%. As another example, a line or a plane can be substantially flatif a peak or depression of the line or plane is no greater than 5 μm, nogreater than 1 μm, or no greater than 0.5 μm.

While the present disclosure has been described and illustrated withreference to specific embodiments thereof, these descriptions andillustrations are not limiting. It should be understood by those skilledin the art that various changes may be made and equivalents may besubstituted without departing from the true spirit and scope of thepresent disclosure as defined by the appended claims. The illustrationsmay not necessarily be drawn to scale. There may be distinctions betweenthe artistic renditions in the present disclosure and the actualapparatus due to manufacturing processes and tolerances. There may beother embodiments of the present disclosure which are not specificallyillustrated. The specification and the drawings are to be regarded asillustrative rather than restrictive. Modifications may be made to adapta particular situation, material, composition of matter, method, orprocess to the objective, spirit and scope of the present disclosure.All such modifications are intended to be within the scope of the claimsappended hereto. While the methods disclosed herein have been describedwith reference to particular operations performed in a particular order,it will be understood that these operations may be combined,sub-divided, or re-ordered to form an equivalent method withoutdeparting from the teachings of the present disclosure. Accordingly,unless specifically indicated herein, the order and grouping of theoperations are not limitations.

What is claimed is:
 1. A semiconductor package, comprising: asemiconductor element; a substrate; and a trace disposed adjacent to asurface of the substrate and including a bonding pad, wherein thebonding pad is a contact pad of the trace; and the bonding padincluding: a first end wall, a second end wall opposite the first endwall, a first side wall, and a second side wall opposite the first sidewall, wherein the first side wall and the second side wall connect thefirst end wall to the second end wall, and the first end wall is widerthan the second end wall; wherein the first end wall is closer to thetrace than is the second end wall, and the first end wall includes asloped portion.
 2. The semiconductor package of claim 1, wherein thefirst end wall is a convex wall comprising a first radius of curvatureand the second end wall is a convex wall comprising a second radius ofcurvature, wherein the first radius of curvature is greater than thesecond radius of curvature.
 3. The semiconductor package of claim 1,wherein a shape of the first end wall represents an arc of a firstcircle and a shape of the second end wall represents an arc of a secondcircle.
 4. The semiconductor package of claim 3, wherein the firstcircle has a first radius R₁ and the second circle has a second radiusR₂, and wherein a relationship between R₁ and R₂ is specified by thefollowing equation: θ₁=sin⁻¹((R₁—R₂)/D) wherein the angle θ₁ is from 0°to about 45° and D represents a distance between an origin of the firstcircle and an origin of the second circle.
 5. The semiconductor packageof claim 4, wherein a ratio of R₁ to R₂ is greater than 1:1.
 6. Thesemiconductor package of claim 4, wherein a ratio of R₁ to R₂ is fromabout 1.1:1 to about 2.5:1.
 7. The semiconductor package of claim 1,wherein a center line of the bonding pad along a length of the bondingpad forms an angle θ₂ with a center line of the trace.
 8. Thesemiconductor package of claim 7, wherein the angle θ₂ is from 0° toabout 45°.
 9. The semiconductor package of claim 1, wherein one or bothof the first side wall and the second side wall are convex.
 10. Thesemiconductor package of claim 1, wherein one or both of the first sidewall and the second side wall incline inwardly, or taper, from the firstend wall to the second end wall, such that the first side wall and thesecond side wall are not parallel.
 11. A substrate, comprising: a tracedisposed adjacent to a surface of the substrate and including a bondingpad, wherein the bonding pad is a contact pad of the trace; and thebonding pad including: a first end wall, a second end wall opposite thefirst end wall, a first side wall, and a second side wall opposite thefirst side wall, wherein the first side wall and the second side wallconnect the first end wall to the second end wall, and the first endwall is wider than the second end wall; wherein the first end wall iscloser to the trace than is the second end wall, and the first end wallincludes a sloped portion.
 12. The substrate of claim 11, wherein thefirst end wall is a convex wall comprising a first radius of curvatureand the second end wall is a convex wall comprising a second radius ofcurvature, wherein the first radius of curvature is greater than thesecond radius of curvature.
 13. The substrate of claim 11, wherein ashape of the first end wall represents an arc of a first circle and ashape of the second end wall represents an arc of a second circle. 14.The substrate of claim 13, wherein the first circle has a first radiusR₁ and the second circle has a second radius R₂, and wherein arelationship between R₁ and R₂ is specified by the following equation:θ₁=sin⁻¹((R₁—R₂)/D) wherein the angle θ₁ is from 0° to about 45° and Drepresents a distance between an origin of the first circle and anorigin of the second circle.
 15. The substrate of claim 14, wherein aratio of R₁ to R₂ is greater than 1:1.
 16. The substrate of claim 14,wherein a ratio of R₁ to R₂ is from about 1.1:1 to about 2.5:1.
 17. Thesubstrate of claim 11, wherein a center line of the bonding pad along alength of the bonding pad forms an angle θ₂ with a center line of thetrace.
 18. The substrate of claim 17, wherein the angle θ₂ is from 0° toabout 45°.
 19. The substrate of claim 18 wherein one or both of thefirst side wall and the second side wall incline inwardly, or taper,from the first end wall to the second end wall, such that the first sidewall and the second side wall are not parallel.
 20. The substrate ofclaim 11, wherein one or both of the first side wall and the second sidewall incline inwardly, or taper, from the first end wall to the secondend wall, such that the first side wall and the second side wall are notparallel.